The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages by Gerard Kelly

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Gerard Kelly

134 pages missing pub info (editions)

nonfiction art technology informative medium-paced
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One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be ...

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